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z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com ssc customer drawn approval approval specification STW8Q2PA
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 1. description 2. absolute maximum ratings 3. electro-optical characteristics 4. optical characteristics 5. reliability test 6. color & binning 7. bin code description 8. outline dimension 9. reel structure 10. packing 11. soldering 12. precaution for use 13. handling of silicone resin leds contents
z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com STW8Q2PA ? pb-free reflow soldering application ? rohs compliant ? white colored smt package ? suitable for all smt assembly and soldering methods ? high reliability (silicone resin) ? high cri = ra 80 (typ.) ? electric signs and signals ? interior automotive ? office automation, electrical appliances, industrial equipment features applications 1. description this surface-mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com parameter symbol value unit power dissipation p d 592 mw forward current i f 160 ma peak forward current i fm [2] 300 ma operating temperature t opr -40~+85 storage temperature t stg -40~+100 junction temperature t j 125 2. absolute maximum ratings [1] [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] ifm was measured at tw 1 msec of pulse width and d 1/10 of duty ratio. [3] leds properties might be different from suggested values l ike above and below tables if operation condition will be exceeded our parameter range. parameter symbol condition min. typ. max. unit forward voltage * [1] v f i f =100ma 2.9 3.2 3.4 v reverse voltage v r i r =5ma - 0.9 1.2 v luminous intensity* [2] (2600~3700k) i v i f =100ma - 8.5 - cd luminous intensity* [2] (3700~7000k) i v i f =100ma - 9.0 - color correlated temperature cct i f =100ma 2,600 - 7,000 k viewing angle [3] 2 1/2 i f =100ma - 120 - deg. color rendering index* ra i f =100ma 75 80 - - esd (hbm) 1.5k ? ;100pf 1 - - kv thermal resistance [4] r th js i f =100ma - 15 - oc/w [1] forward current is 50ma per di e for parallel inner circuit. package total forward current is 100ma [2] the luminous intensity iv was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the led package. [3] 2 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [4] thermal resistance: r th js (junction / solder) * tolerance : v f : 0.1v, i v : 10%, ra : 3, x,y : 0.01 [note] all measurements were made under the standardized environment of ssc. 3. electro-optical characteristics
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 4. optical characteristics -90 -60 -30 90 60 30 0 directivity ta=25 forward voltage vs. forward current ta=25 0 20 40 60 80 100 120 140 160 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 relative luminous intensity forward current i f [ma] forward current vs. relative luminous intensity ta=25 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 1 10 100 forward current i f [ma] forward voltage v f [v] forward current vs. chromaticity coordinate ta=25 0.336 0.337 0.338 0.339 0.340 0.341 0.360 0.362 0.364 0.366 0.368 20ma 60ma 100ma 150ma 200ma y x
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com relative light output vs. junction temperature i f =100ma 25 50 75 100 125 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage junction temperature tj( o c) forward voltage shift vs. junction temperature i f =100ma 25 50 75 100 125 0.0 0.2 0.4 0.6 0.8 1.0 relative light output junction temperature tj( o c) junction temperature ( ) vs. chromaticity coordinate if=100ma 0.315 0.320 0.325 0.330 0.310 0.315 0.320 0.325 0.330 0.335 25 45 65 85 105 y x
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com spectrum ta=25, i f =100ma 300 400 500 600 700 800 0.0 0.5 1.0 2600~3700k 3700~4700k 4700~7000k relative emission intensity wavelength [nm] ambient temperature vs. maximum forward current -40 -20 0 20 40 60 80 100 0 20 40 60 80 100 120 140 160 180 200 forward current i f [ma] ambient temperature ta( o c) rth j-a =100 o c/w
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 5. reliability test item reference test conditions duration / cycle number of damaged thermal shock eiaj ed-4701 t a =-40 o c(30min) ~ 100 o c(30min) 100 cycle 0/22 high temperature storage eiaj ed-4701 t a =100 o c 1000 hours 0/22 high temp. high humidity storage eiaj ed-4701 t a =60 o c, rh=90% 1000 hours 0/22 low temperature storage eiaj ed-4701 t a =-40 o c 1000 hours 0/22 operating endurance test internal reference t a =25 o c, i f =100ma 1000 hours 0/22 high temperature high humidity life test internal reference t a =60 o c, rh=90%, i f =100ma 500 hours 0/22 high temperature life test internal reference t a =85 o c, i f =100ma 500 hours 0/22 low temperature life test internal reference t a =-40 o c, i f =100ma 1000 hours 0/22 esd(hbm) mil-std- 883d 1kv at 1.5k ? ; 100pf 3 time 0/22 reflow t so l 260 < 10sec. reflow soldering 3 time 0/22 item symbol condition criteria for judgment min max forward voltage v f i f =100ma - usl [1] 1.2 luminous intensity i v i f =100ma lsl [2] 0.5 - note : [1] usl : upper standard level [2] lsl : lower standard level criteria for judging the damage
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515 520 525 530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620 630 830 cie y ci e x
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 7000k 2600k 2700k 2900k 3000k 3200k 3500k 3700k 4000k 4200k 4500k 4700k 5000k 5300k 5600k 6000k 6500k cie x cie y a5 a3 a1 a9 a6 a4 a2 a0 a8 a7 c8 c9 c0 c1 c2 c3 c4 c5 c6 c7 b8 b9 b0 b1 b2 b3 b4 b5 b6 b7 d8 d9 d0 d1 d2 d3 d4 d5 d6 d7 f8 f9 f0 f1 f2 f3 f4 f5 f6 f7 g8 g9 g0 g1 g2 g3 g4 g5 g6 g7 h8 h9 h0 h1 h2 h3 h4 h5 h6 h7 e8 e9 e0 e1 e2 e3 e4 e5 e6 e7 energy star rank energy star rank
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning 6500~7000k a0 a2 a4 a6 a8 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3028 0.3304 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3082 0.3046 0.3041 0.324 0.3055 0.3177 0.3068 0.3113 0.3082 0.3046 0.3096 0.298 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3155 0.312 0.3164 0.3046 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3155 0.312 6000~6500k a1 a3 a5 a7 a9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3115 0.3393 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3155 0.312 0.3126 0.3324 0.3136 0.3256 0.3146 0.3187 0.3155 0.312 0.3164 0.3046 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3225 0.319 0.323 0.311 0.3205 0.3481 0.321 0.3408 0.3216 0.3334 0.3221 0.3261 0.3225 0.319 5600~6000k b0 b2 b4 b6 b8 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3207 0.3462 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.32 0.3572 0.3212 0.3389 0.3217 0.3316 0.3222 0.3243 0.3226 0.3178 0.3207 0.3462 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3295 0.3234 0.3292 0.3539 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.329 0.3656 5300~5600k b1 b3 b5 b7 b9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3292 0.3539 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.329 0.3656 0.3293 0.3461 0.3293 0.3384 0.3294 0.3306 0.3295 0.3234 0.3292 0.3539 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3364 0.3288 0.3376 0.3616 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3381 0.374
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning 5000~5300k c0 c2 c4 c6 c8 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3376 0.3616 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3381 0.374 0.3373 0.3534 0.3369 0.3451 0.3366 0.3369 0.3364 0.3288 0.347 0.381 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3433 0.3345 0.3463 0.3687 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3376 0.3616 4700~5000k c1 c3 c5 c7 c9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3463 0.3687 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.347 0.381 0.3456 0.3601 0.3448 0.3514 0.344 0.3428 0.3433 0.3345 0.3572 0.3891 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.35 0.34 0.3552 0.376 0.3552 0.376 0.3539 0.3669 0.3526 0.3578 0.3514 0.3487 0.3463 0.3687 4500~4700k d0 d2 d4 d6 d8 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3548 0.3736 0.3536 0.3646 0.3523 0.3555 0.3511 0.3465 0.3562 0.3826 0.3536 0.3646 0.3523 0.3555 0.3511 0.3465 0.3498 0.3385 0.3548 0.3736 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3575 0.3441 0.3641 0.3804 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3661 0.39 4200~4500k d1 d3 d5 d7 d9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3641 0.3804 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3661 0.39 0.3625 0.3711 0.3608 0.3616 0.359 0.3521 0.3575 0.3441 0.3641 0.3804 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.365 0.3489 0.3736 0.3874 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.376 0.3974
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com color rank 6. color & binning * measurement uncertainty of the color coordinates : 0.01 4000~4200k e0 e2 e4 e6 e8 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3736 0.3874 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.376 0.3974 0.3714 0.3775 0.3692 0.3677 0.367 0.3578 0.365 0.3489 0.3736 0.3874 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3758 0.355 0.3869 0.3958 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3902 0.4067 3700~4000k e1 e3 e5 e7 e9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3869 0.3958 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3902 0.4067 0.3842 0.3855 0.3813 0.3751 0.3783 0.3646 0.3758 0.355 0.3869 0.3958 0.397 0.3935 0.3934 0.3825 0.3898 0.3716 0.3863 0.361 0.4006 0.4044 0.4006 0.4044 0.397 0.3935 0.3934 0.3825 0.3898 0.3716 0.4044 0.416 3500~3700k f0 f2 f4 f6 f8 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3996 0.4015 0.396 0.3907 0.3925 0.3798 0.3889 0.369 0.4037 0.414 0.396 0.3907 0.3925 0.3798 0.3889 0.369 0.386 0.36 0.3996 0.4015 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.3983 0.366 0.4146 0.4089 0.4146 0.4089 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.4197 0.4217 3200~3500k f1 f3 f5 f7 f9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4146 0.4089 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.4197 0.4217 0.4104 0.3978 0.4062 0.3865 0.4017 0.3751 0.3983 0.366 0.4146 0.4089 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4104 0.3715 0.4299 0.4165 0.4299 0.4165 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4354 0.4288
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com color rank 6. color & binning * measurement uncertainty of the color coordinates : 0.01 3000~3200k g0 g2 g4 g6 g8 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4299 0.4165 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4354 0.4288 0.4248 0.4048 0.4198 0.3931 0.4147 0.3814 0.4102 0.371 0.4299 0.4165 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4207 0.3744 0.443 0.4212 0.443 0.4212 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4487 0.4333 2900~3000k g1 g3 g5 g7 g9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.443 0.4212 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4487 0.4333 0.4374 0.4093 0.4317 0.3973 0.4259 0.3853 0.4207 0.3744 0.443 0.4212 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4312 0.3778 0.4562 0.426 0.4562 0.426 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4619 0.4378 2700~2900k h0 h2 h4 h6 h8 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4562 0.426 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4619 0.4378 0.4499 0.4138 0.4436 0.4015 0.4373 0.3893 0.4312 0.3778 0.4562 0.426 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4422 0.3805 0.4687 0.4289 0.4687 0.4289 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4747 0.441 2600~2700k h1 h3 h5 h7 h9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4687 0.4289 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4747 0.441 0.462 0.4166 0.4551 0.4042 0.4483 0.3919 0.4422 0.3805 0.4687 0.4289 0.474 0.4194 0.4666 0.4069 0.4593 0.3944 0.4527 0.383 0.481 0.4319 0.481 0.4319 0.474 0.4194 0.4666 0.4069 0.4593 0.3944 0.4875 0.4435
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com bin code luminous intensity cie forward voltage s5 g5 z1 color rank @ i f = 100ma a~h forward voltage (v) @ i f = 100ma bin code min. max. y3 2.9 3.0 z1 3.0 3.1 z2 3.1 3.2 z3 3.2 3.3 a1 3.3 3.4 luminous intensity (mcd) @ i f = 100ma flux (lm) bin code min. max. typ q5 7500 8000 25.8 r0 8000 8500 27.7 r5 8500 9000 28.7 s0 9000 9500 30.6 s5 9500 10000 33 t0 10000 10500 34 t5 10500 11000 35.6 v0 11000 11500 36 [note] all measurements were made under the standardized environment of ssc. in order to ensure availability, sing le color rank will not be orderable. 7. bin code description available ranks not yet available ranks cct iv rank 5300~7000 k (cie a,b) q5 r0 r5 s0 s5 t0 t5 v0 3700~5300 k (cie c,d,e) q5 r0 r5 s0 s5 t0 t5 v0 2600~3700 k (cie f,g,h) q5 r0 r5 s0 s5 t0 t5 v0
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 8. outline dimension a c2 c1 [recommended solder pattern] slug (anode) n.c package marking ( tolerance: 0.1, unit: mm ) [note] forward current is 50ma per die for parallel inner circuit. package total forward current is 100ma
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 180 2 13 22 60 15.41.0 130.3 9. reel structure ( tolerance: 0.2, unit: mm ) (1) quantity : 3,500pcs/reel (2) cumulative tolerance : cumula tive tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion strength to be 0.1-0.7n when the cover tape is turned off from the carrier tape at the angle of 10o to the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 10. soldering lead solder pre-heat 120~150 pre-heat time 120 sec. max. peak-temperature 240 max. soldering time condition 10 sec. max. lead free solder pre-heat 150~200 pre-heat time 120 sec. max. peak-temperature 260 max. soldering time condition 10 sec. max. lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead-free solder (3) hand soldering conditions do not exceed 4 seconds at ma ximum 315oc under soldering iron. (4) the encapsulated material of the leds is silicone. precautions should be taken to avoid the strong pressure on the encapsulated part. so when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) it is recommended that the customer use the nitrogen reflow method. (6) repairing should not be done after the leds have been soldered. (7) reflow soldering should not be done more than two times. in the case of more than 24 hours passed so ldering after first, leds will be damaged. lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com c a b 1 side 7inch 245 220 142 size (mm) outer box structure material : paper(sw3b(b)) type a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. rohs 11. packing
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 12. precaution for use (1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. otherwise, to store them in the following environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh (2) attention after open. led is correspond to smt, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. attention in followed; keeping of a fraction temperature : 5 ~ 40oc humidity : less than 10% (3) in the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60 5oc. (4) silver plating might be tarnished in th e environment that contains corrosive gases and materials. also any product that ha s tarnished lead might be decreased the solder-ability and optical-electrical properties compare to normal ones. please do not expose the product in the corrosive environment during the storage. (5) any mechanical force or any excess vibrat ion shall not be accepted to apply during cooling process to normal temperature after soldering. (6) quick cooling shall be avoided. (7) components shall not be mounted on warped direction of pcb. (8) anti radioactive ray design is not considered for the products. (9) this device should not be used in any type of fluid such as water, oil, organic solvent etc. when washing is required, ipa should be used. (10) when the leds are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) the leds must be soldered within seven days after opening the moisture-proof packing. (12) repack unused products with anti-moistur e packing, fold to close any opening and then store in a dry place. (13) the appearance and specifications of the product may be modi fied for improvement without notice.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 rev. 05 rev. 05 october 2010 october 2010 www.seoulsemicon.com www.seoulsemicon.com 13. handling of silicone resin leds 1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. 2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. 3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the led?s reflector area. 4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the handling of such devices. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. 6) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space.

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